Handwritten word recognition with character and inter-characterneural networks

An off-line handwritten word recognition system is described. Images of handwritten words are matched to lexicons of candidate strings. A word image is segmented into primitives. The best match between sequences of unions of primitives and a lexicon string is found using dynamic programming. Neural networks assign match scores between characters and segments. Two particularly unique features are that neural networks assign confidence that pairs of segments are compatible with character confidence assignments and that this confidence is integrated into the dynamic programming. Experimental results are provided on data from the U.S. Postal Service.     

Tunnel stability and arching effects during tunneling in soft clayey soil

A series of centrifuge model tests and numerical simulations of these tests were carried out to investigate the surface settlement troughs, excess pore water pressure generation, tunnel stability and arching effects that develop during tunneling in soft clayey soil. The two methods were found to provide consistent results of the surface settlement troughs, excess pore water generation, and the overload factors at collapse for both single and parallel tunneling. The arching ratio describes the evolution of the arching effects on the soil mass surrounding tunnels and can be derived from the numerical analysis. The boundaries of the arching zones for both single tunneling and parallel tunneling were determined. In addition, the boundaries of the positive and negative arching zones were also proposed.     

Line balancing in a just-in-time production environment: balancing multiple U-lines

The introduction of multiple, independent production lines has helped many firms to increase their production flexibility, provide for redundancy when equipment breaks down, reduce idle time and labor costs, and achieve many other benefits. This paper introduces and formalizes the multiple U-line balancing problem. Optimal solution methodologies are provided for Type I (minimize the number of stations for a given cycle time), Type II (minimize the cycle time for a given number of stations), and cost-minimization line-balancing problems. A branch-and-bound algorithm is also developed for the situation in which equipment requirements are dependent on the line configuration and the task assignment to stations. Computational results indicate that the greatest benefit of exploiting multiple lines occurs for smaller cycle-time problems that require higher output.     

闪存器与移动电子设备

闪存器技术于上世纪80年代中期面世,在不到20年的时间里,就出现了迅猛增长,其应用范围从个人电脑的引导代码存储一直到近期出现的PDA、数码相机和手机中的代码和数据存储。随着移动电子的持续增长,我们对在移动电子中获得成功应用的闪存器功能和优点进行一次回顾。闪存器的历史沿革“闪存(Flash)”这一名称,是源于该存储器件只需单步操作即能擦除其中所有内容的能力。军用装备很早就从这一能力中获益,军用装备都包含机密信息,一旦即将落入敌手,就应该迅速予以破坏。与EEPROM类似,Flash的数据存储也是通过向其晶体管栅区存入电荷来实现…     

Surface modification and functionalization of electroactive polymer films via grafting of polyelectrolyte,polyampholyte and polymeric acids

Films of electroactive polymers, such as polyaniline (PAN) in its emeraldine base form, and poly(3-alkylthiophene), poly(3-hexylthiophene) (P6TH), poly(3-octylthiophene) (P8TH), and poly(3-dodecylthiophene) (P12TH) can be readily functionalized via thermal or near ultraviolet-light-induced surface graft copolymerization with monomers of polyelectrolyte, polyampholyte and polymeric acids. The monomers used in the present work include dimethyl sulphate quaternized dimethylamino-ethylmethacrylate (DMAEM·C₂H₆SO₄), 3-dimethyl(methacryloyloxyethyl)ammonium propane sulphonate (DMAPS), acrylic acid (AAc) and a sodium salt of styrene sulphonic acid (NaSS). The surface structures and compositions of the electroactive polymer films after functionalization via graft copolymerization were characterized by angle-resolved X-ray photoelectron spectroscopy. Graft copolymerization of poly(3-alkylthiophene) films, but not PAN films, with the hydrophilic monomers readily results in a stratified surface microstructure arising from the migration of the hydrophilic graft chains beneath a thin surface layer which is much richer in the substrate chains. On the other hand, graft copolymerization of PAN films with AAc and NaSS readily gives rise to a self-protonated (and thus conductive) surface structure.     

Synthesis and characterization of novel copolymers with the trimethylsilyl group for deep‐UV photoresists

N‐(4‐Acetoxyphenyl) maleimide (APMI) and three kinds of comonomers bearing a trimethylsilyl group were copolymerized at 60°C in the presence of azobisisobutyronitrile (AIBN) as an initiator in 1,4‐dioxane to obtain the three IP, IIP, and IIIP copolymers. These copolymers were removed from the acetoxy group in a transesterification process into new IVP, VP, and VIP copolymers with a pendant hydroxyl group. Two modified processes were adopted to prepare photoresists using these copolymers. The first process involved mixing the dissolution inhibitor, o‐nitrobenzyl cholate, with the new copolymers. Second, o‐nitrobenzyl cholate was introduced into the copolymers using 1,8‐diazabicyclo[5.4.0]undec‐7‐ene (DBU) in dimethylformamide (DMF). The cyclic maleimide structure is responsible for the high thermal stability of these copolymers. After irradiation using deep–UV light and development with aqueous Na₂CO₃ (0.01 wt %), the developed patterns showed positive images and exhibited good adhesion to the silicon wafer without using any adhesion promoter. The resolution of these resists was at least 0.8 μm and an oxygen‐plasma etching rate was 1/5.3 to that of hard‐baked HPR‐204. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 83: 2791–2798, 2002; DOI 10.1002/app.10255     

Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis

The stress buffer layer (SBL) is a widely applied improvement in many advanced packages used to release the stress concentration at solder joints. However, it has been generally found that the metal line adjacent to the SBL may suffer larger deformation and its reliability should be addressed. In this study, the panel level package (PLP) technology with solder on polymer (SOP) structure is selected as the testing sample to investigate the effect of SBL. The ball shear strength test is conducted first to investigate the reliability of metal trace in PLP. In addition, finite element (FE) analysis is applied to understand the actual thermo-mechanical behavior of PLP after its assembly. The package-level and board-level reliability assessments are compared, and the suggested layout of the redistribution layer on the SBL is provided herein.     

A wafer-level microcap array to enable high-yield microsystem packaging

Packaging represents a significant and expensive obstacle in commercializing microsystem technology (MST) devices such as microelectromechanical systems (MEMS), microopticalelectromechanical systems (MOEMS), microsensors, microactuators, and other micromachined devices. This paper describes a novel wafer-level protection method for MSTs which facilitate improved manufacturing throughput and automation in package assembly, wafer-level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized microcap array. This array consists of an assortment of small caps molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments associated with packaging. It may also include modifications which enhance its adhesion to the MST wafer or increase the MST device function. Depending on the application, the micromolded cap can be designed and modified to facilitate additional functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. The fabrication and materials selection of the microcap device is discussed in this paper. The results of wafer-level microcap packaging demonstrations are also presented.